The Effect of Microstructure on Electromigration-Induced Failure Development

Electromigration and stress-induced voiding in fine Al and Al-alloy thin-film lines

Physical phenomena underlying failure due to electromigration and stress-induced voiding in fine AI and AI-alloy thin-film conducting lines are examined in the context of accelerated testing methods and structures. Aspects examined include effects due to line isolation (the absence of reservoirs at conductor ends), solute and precipitate phenomena, conductor critical (Blech) length, microstruct...

Electromigration Modeling for Interconnect Structures in Microelectronics

Electromigration is one of the most important reliability issues in semiconductor technology. Its complex character demands comprehensive physical modeling as basis for analysis. Simulation of electromigration induced interconnect failure focuses on the life-cycle of intrinsic voids, which consists of two distinct phases: void nucleation and void evolution. We present models for both phases as ...

Crystal texture and electromigration damage in Al-based interconnect lines studied by ACOM with the SEM

Electromigration, as one of the main failure mechanismus of VLSI circuits, is of great concern to microelectronics industry. The effects of grain morphology as well as texture can be studied on a mesoscale by Automated Crystal Orientation Mapping (ACOM) in the SEM since it provides a detailed description of the microstructure. Textural functions (e.g. pole figures, ODF, MODF), statistical param...

Effect of Microstructure on Electromigration-Induced Stress

In this paper, a finite element based simulation approach for predicting the effect of microstructure on the stresses resulting from electromigration-induced diffusion is described. The electromigration and stress-driven diffusion equation is solved coupled to the mechanical equilibrium and elastic constitutive equation, where a diffusional inelastic strain is introduced. Here, the focus is on ...

Contents 1 Copper Microstructure Impact on Evolution of Electromigration Induced